From Silicon to Transformation: Intelligent Solutions for Smart Cities

From Silicon to Transformation: Intelligent Solutions for Smart Cities

From feasibility to production, we design chips that drive smart cities and sustainable systems

From feasibility to production, we design chips that drive smart cities and sustainable systems

Artificial intelligence is no longer a tool, it's the very infrastructure of modern life.

The world is moving into an era where artificial intelligence is no longer a tool, but the very infrastructure of modern life.

At Cognicatus, we design advanced chips that push beyond cognition, hardware that doesn’t just process information but empowers machines, cities, and societies to think, adapt, and evolve. We also believe sustainability will be an imperative foundation for the data centers of the future and we invest in immersion and liquid cooling with the potential to harvest useful energy from all computing activities.

Beyond Cognition

The Technology Behind the Vision

Adaptive Intelligence → Architectures optimized for machine learning, neuromorphic computing, and real-time decision-making.

Scalable Performance → From edge devices to hyperscale AI data centers.

Sustainable Power → Energy-efficient design to reduce the footprint of AI as it scales globally.

The World Is Entering the
Age of Intelligent Infrastructure

The World Is Entering the Age of Intelligent Infrastructure

The World Is Entering the Age of Intelligent Infrastructure

AI capacity is growing at an unprecedented rate — global demand for compute is doubling every 3–6 months.

AI capacity is growing at an unprecedented rate — global demand for compute is doubling every 3–6 months.

Smart cities are emerging as the new urban model, relying on real-time data, adaptive systems, and predictive infrastructure.

Smart cities are emerging as the new urban model, relying on real-time data, adaptive systems, and predictive infrastructure.

AI is no longer confined to labs — it is embedded in daily life, from healthcare to mobility, education, and energy.

AI is no longer confined to labs — it is embedded in daily life, from healthcare to mobility, education, and energy.

The challenge

The energy and hardware
required to sustain this growth.

The opportunity

To reimagine chips that don’t
just keep up, but lead the way.

Applications

A fast black sports car races down the highway.

AI Data Centers

High-performance chips optimized for large-scale training and inference.

A fast black sports car races down the highway.

AI Data Centers

High-performance chips optimized for large-scale training and inference.

A fast black sports car races down the highway.

AI Data Centers

High-performance chips optimized for large-scale training and inference.

A fast black sports car races down the highway.
A person stands in a sandstone cave.
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An orange cube-shaped side table is shown.
A fast black sports car races down the highway.

AI Data Centers

High-performance chips optimized for large-scale training and inference.

A fast black sports car races down the highway.
A person stands in a sandstone cave.
closed window
An orange cube-shaped side table is shown.

We partner and work with the best

We partner and work with the best

Chip Tape-outs

2008

TSMC

80 nm

TSMC 80 nm die, early advanced-node tape-out.


2010-2014

AnaCatum Design

Subsidiary developing mixed-signal ADC architectures (A2DFraming) and Cognitive Converter IP.

2011-2018

SMIC

180 nm (multiple TOs)

Multiple 180 nm tape-outs at SMIC

- production & process illustration.


2016

TSMC

180 nm (2 TOs)

Two 180 nm tape-outs at TSMC.

2016

TSMC

55 nm (flash)

TSMC 55 nm flash memory tape-out.

2017

SMIC

40 nm (flash)

TSMC 40 nm flash tape-out.

2019

TSMC

55 nm (mixed)

TSMC 55 nm mixed-signal tape-out.


2020

TSMC

12 nm

TSMC 12 nm tape-out - significantly denser geometry versus older nodes.

2019 & 2024

GlobalFoundries (GF) — 22 nm FDX

GlobalFoundries 22 nm FDX tape-outs - FDX / FD-SOI style technology.

2025

TSMC

6 nm

TSMC 6 nm tape-out - modern AI/compute oriented processes.

2026

TSMC

6 nm (planned)

Planned TSMC 6 nm tape-out.


2027

TSMC

4 nm (planned)

Planned TSMC 3 nm tape-out - leading-edge node.

2008

TSMC

80 nm

TSMC 80 nm die, early advanced-node tape-out.


2010-2014

AnaCatum Design

Subsidiary developing mixed-signal ADC architectures (A2DFraming) and Cognitive Converter IP.

2011-2018

SMIC

180 nm (multiple TOs)

Multiple 180 nm tape-outs at SMIC

- production & process illustration.


2016

TSMC

180 nm (2 TOs)

Two 180 nm tape-outs at TSMC.

2016

TSMC

55 nm (flash)

TSMC 55 nm flash memory tape-out.

2017

SMIC

40 nm (flash)

TSMC 40 nm flash tape-out.

2019

TSMC

55 nm (mixed)

TSMC 55 nm mixed-signal tape-out.


2020

TSMC

12 nm

TSMC 12 nm tape-out - significantly denser geometry versus older nodes.

2019 & 2024

GlobalFoundries (GF) — 22 nm FDX

GlobalFoundries 22 nm FDX tape-outs - FDX / FD-SOI style technology.

2025

TSMC

6 nm

TSMC 6 nm tape-out - modern AI/compute oriented processes.

2026

TSMC

6 nm (planned)

Planned TSMC 6 nm tape-out.


2027

TSMC

4 nm (planned)

Planned TSMC 3 nm tape-out - leading-edge node.

2008

TSMC

80 nm

TSMC 80 nm die, early advanced-node tape-out.


2010-2014

AnaCatum Design

Subsidiary developing mixed-signal ADC architectures (A2DFraming) and Cognitive Converter IP.

2011-2018

SMIC

180 nm (multiple TOs)

Multiple 180 nm tape-outs at SMIC

- production & process illustration.

2016

TSMC

180 nm (2 TOs)

Two 180 nm tape-outs at TSMC.


2016

TSMC

55 nm (flash)

TSMC 55 nm flash memory tape-out.

2017

SMIC

40 nm (flash)

TSMC 40 nm flash tape-out.

2019

TSMC

55 nm (mixed)

TSMC 55 nm mixed-signal tape-out.


2020

TSMC

12 nm

TSMC 12 nm tape-out - significantly denser geometry versus older nodes.

2019 & 2024

GlobalFoundries (GF) — 22 nm FDX

GlobalFoundries 22 nm FDX tape-outs

- FDX / FD-SOI style technology.

2025

TSMC

6 nm

TSMC 6 nm tape-out - modern AI/compute oriented processes.

2026

TSMC

6 nm (planned)

Planned TSMC 6 nm tape-out.


2027

TSMC

4 nm (planned)

Planned TSMC 3 nm tape-out - leading-edge node.

Building a Smarter, Greener Future

AI’s growth must not come at the planet’s expense. Cognicatus is committed to designing chips that reduce energy demand and extend efficiency across the entire AI infrastructure. By creating smarter semiconductors, we support both technological progress and environmental responsibility.

Partner with Cognicatus

Partner with Cognicatus

Ready to push performance, intelligence, and sustainability together?

Ready to push performance, intelligence, and sustainability together?

Ready to push performance, intelligence, and sustainability together?

Let’s Connect

Cognicatus AB

Cognicatus was founded in 2008 to deliver premium chip design and consulting services, building on decades of expertise in analog, digital, mixed-signal, and RF chip development. Our mission is to create intelligent, efficient, and sustainable semiconductor solutions for data centers, smart cities, and advanced industries.

Cognicatus AB

Cognicatus was founded in 2008 to deliver premium chip design and consulting services, building on decades of expertise in analog, digital, mixed-signal, and RF chip development. Our mission is to create intelligent, efficient, and sustainable semiconductor solutions for data centers, smart cities, and advanced industries.

Cognicatus AB

Cognicatus was founded in 2008 to deliver premium chip design and consulting services, building on decades of expertise in analog, digital, mixed-signal, and RF chip development. Our mission is to create intelligent, efficient, and sustainable semiconductor solutions for data centers, smart cities, and advanced industries.